As an integral part of laser device manufacturing, Visotek has a variety of capabilities to do microelectronic and laser diode packaging and manufacturing. These resources allow Visotek to provide services that range from small prototype runs to manufacturing production quantities. We can provide solder evaporation, solder reflow in a vacuum or forming gas environment, and automated gold ball wire bonding. Assemblies can be palletized to enable multiple products to pass through the assembly process at the same time for greater throughput. With vast experience in micro electronic and laser diode packaging, Visotek is ready to meet your complicated product requirements with a customized solution.
Equipment and Capabilities;
Visotek and its research and development partner Fraunhofer USA, Center for Laser Technology have produced a single emitter laser diode package in development work sponsored by the Michigan 21st Century Jobs Fund and the Defense Advanced Research Projects Agency (DARPA). Visotek utilized thin film solders, a reflow process and customized fixturing that positioned the laser diodes with micron accuracy far beyond industry norms. A unique and complicated automated wirebonding fixture and process was developed that allows hundreds of wirebonds to be applied at many different internal package heights. The outcome of the effort was a true leapfrog in the brightness of then currently available diode lasers. Ultra high brightness (UHB), high power diode laser systems, patented by Fraunhofer, enable new applications in the industrial manufacturing and homeland security markets, allowing the end user to realize all the benefits of high performance lasers with the advantages of traditional diode lasers; including the compact footprint, low cost of ownership, high efficiency and reliability.
